HiSilicon Kirin 820 5G Testing in 2 Benchmarks. Specifications: The architecture is Cortex-A76 / Cortex-A55 , the number of cores is 8, and the number of threads is 8. The base clock speed of HiSilicon Kirin 820 5G is 0.85 GHz. The model supports motherboards with a socket of N/A. The Supported Memory Type is LPDDR4X-2133 (maximum ). PCIe version is .
HiSilicon Kirin 820 5G in 2 Benchmarks. 7 nm, 0.85 GHz
Basic specifications HiSilicon Kirin 820 5G
HiSilicon Kirin 820 5G technical specifications and performance testing in benchmarks will open you to all the advantages and disadvantages of HiSilicon Kirin 820 5G. Please learn the key figures of the clock speed and L2/L3 cache and make the right decision.
The general technical information depicts the base data of a CPU’s number of cores and threads, and base and turbo-boost clock speed. Here are key features influencing the performance.
|CPU Cores / Threads:||8 / 8|
|Core architecture:||hybrid (big.LITTLE)|
|A core:||4x Cortex-A76|
|B core:||4x Cortex-A55|
|A-Core Frequency:||2.36 GHz|
|B-Core Frequency:||1.84 GHz|
CPU generation and family
The generation of a HiSilicon Kirin 820 5G CPU, the segment of usage (computer, server or mobile type), the preceding model of a CPU, and its successor.
|Name:||HiSilicon Kirin 820 5G|
|CPU group:||HiSilicon Kirin 810/820|
Not every CPU is equipped with a built-in graphic core. However, if HiSilicon Kirin 820 5G has internal graphics, it is another advantage. Please pay attention to the base and turbo clock speed of the graphic core.
|GPU name:||ARM Mali-G57 MP6|
|GPU frequency:||0.85 GHz|
|GPU (Turbo):||No turbo|
|Max. GPU Memory:||4 GB|
Hardware codec support
Technical information that does not affect the final performance.
|h265 / HEVC (8 bit):||Decode / Encode|
|h265 / HEVC (10 bit):||Decode / Encode|
|h264:||Decode / Encode|
|VP8:||Decode / Encode|
|VP9:||Decode / Encode|
|AVC:||Decode / Encode|
|VC-1:||Decode / Encode|
|JPEG:||Decode / Encode|
Which memory does HiSilicon Kirin 820 5G support? How many channels are operated and how large the memory capacity can be to build in the motherboard? Here are the general data on the capacity and other technology.
Thermal Management (TDP)
TDP shows which cooling system is necessary for a HiSilicon Kirin 820 5G CPU. It stands for Thermal Design Power. Here are all the CPU specifications: the maximum temperature, the approximate thermal calculation for power supply and others.
|TDP (PL1):||6 W|
HiSilicon Kirin 820 5G technical specifications contain the general data on the technological process of chip production (in nanometer), the cache of L2/L3, the architecture of the central core and ISA extension.
|Instruction set (ISA):||ARMv8-A64 (64 bit)|
|Architecture:||Cortex-A76 / Cortex-A55|
iGPU - FP32 Performance HiSilicon Kirin 820 5G
The testing benchmark iGPU is integrated graphics cores in the central processor. The general graphics performance to benchmark the high-speed performance of the video chip is tested. The evaluation scores are presented below. Pay attention that not every manufacturer builds in an inner graphics core. Thus, the general results of the performance do not depend on this parameter, that is considered of good advantage.
AnTuTu 8 benchmark HiSilicon Kirin 820 5G
Here is the evaluation of the mobile processor in the professional benchmark of AnTuTu 8. AnTuTu 8 show the high speed of cores, memory, and graphics chips in mobile segments. We recommend learning the results and comparing them if necessary.