HiSilicon Kirin 990 4G in 0 Benchmarks. 7 nm, 1.86 GHz

HiSilicon Kirin 990 4G Testing in 0 Benchmarks. Specifications: The architecture is  , the number of cores is 8, and the number of threads is 8. The base clock speed of HiSilicon Kirin 990 4G is 1.86 GHz. The model supports motherboards with a socket of N/A. The Supported Memory Type is LPDDR4X-2133 (maximum 8 GB).  PCIe version is .

Basic specifications HiSilicon Kirin 990 4G

HiSilicon Kirin 990 4G technical specifications and performance testing in benchmarks will open you to all the advantages and disadvantages of HiSilicon Kirin 990 4G. Please learn the key figures of the clock speed and L2/L3 cache and make the right decision.

Technical specs

The general technical information depicts the base data of a CPU’s number of cores and threads, and base and turbo-boost clock speed. Here are key features influencing the performance.

CPU Cores / Threads: 8 / 8
Core architecture: hybrid (Prime / big.LITTLE)
A core: 2x Cortex-A76
B core: 2x Cortex-A76
C core: 4x Cortex-A55
Hyperthreading: No
Overclocking: No
Frequency: 1.86 GHz
Turbo Frequency (1 Core): 2.09 GHz
Turbo Frequency (8 Cores): 2.86 GHz

CPU generation and family

The generation of a HiSilicon Kirin 990 4G CPU, the segment of usage (computer, server or mobile type), the preceding model of a CPU, and its successor.

Name: HiSilicon Kirin 990 4G
Family: HiSilicon Kirin
CPU group: HiSilicon Kirin 990
Generation: Bifrost 3
Segment: Mobile
Predecessor: --
Successor: --


Not every CPU is equipped with a built-in graphic core. However, if HiSilicon Kirin 990 4G has internal graphics, it is another advantage. Please pay attention to the base and turbo clock speed of the graphic core.

GPU name: ARM Mali-G76 MP16
GPU frequency: 0.60 GHz
GPU (Turbo): No turbo
Execution units: 16
Shader: 256
Max. GPU Memory: 4 GB
Max. displays: 2
Generation: Bifrost 3
Direct X: 12
Technology: 7 nm
Release date: Q3/2018

Hardware codec support

Technical information that does not affect the final performance.

h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode / Encode
h264: Decode / Encode
VP8: Decode / Encode
VP9: Decode / Encode
AV1: No
AVC: Decode / Encode
VC-1: Decode / Encode
JPEG: Decode / Encode

Memory Specifications

Which memory does HiSilicon Kirin 990 4G support? How many channels are operated and how large the memory capacity can be to build in the motherboard? Here are the general data on the capacity and other technology.

Memory type: LPDDR4X-2133
Max. Memory: 8 GB
Memory channels: 4

Thermal Management (TDP)

TDP shows which cooling system is necessary for a HiSilicon Kirin 990 4G CPU. It stands for Thermal Design Power. Here are all the CPU specifications: the maximum temperature, the approximate thermal calculation for power supply and others.

TDP (PL1): 6 W
TDP (PL2): --
TDP up: --
TDP down: --
Tjunction max.: --

Additional specifications

HiSilicon Kirin 990 4G technical specifications contain the general data on the technological process of chip production (in nanometer), the cache of L2/L3, the architecture of the central core and ISA extension.

Instruction set (ISA): x86-64 (64 bit)
L2-Cache: --
L3-Cache: 2.00 MB
Technology: 7 nm
Virtualization: None
Socket: N/A
Release date: Q3/2019
Part Number: --

Use Conditions

Used in: Huawei Mate 30 Pro