HiSilicon Kirin 970 Testing in 0 Benchmarks. Specifications: The architecture is , the number of cores is 8, and the number of threads is 8. The base clock speed of HiSilicon Kirin 970 is 1.84 GHz. The model supports motherboards with a socket of N/A. The Supported Memory Type is LPDDR4X-2133 (maximum 8 GB). PCIe version is .
HiSilicon Kirin 970 in 0 Benchmarks. 16 nm, 1.84 GHz
Basic specifications HiSilicon Kirin 970
HiSilicon Kirin 970 technical specifications and performance testing in benchmarks will open you to all the advantages and disadvantages of HiSilicon Kirin 970. Please learn the key figures of the clock speed and L2/L3 cache and make the right decision.
The general technical information depicts the base data of a CPU’s number of cores and threads, and base and turbo-boost clock speed. Here are key features influencing the performance.
|CPU Cores / Threads:||8 / 8|
|Core architecture:||hybrid (big.LITTLE)|
|A core:||4x Cortex-A73|
|B core:||4x Cortex-A53|
|Turbo Frequency (1 Core):||2.40 GHz|
|Turbo Frequency (8 Cores):||2.40 GHz|
CPU generation and family
The generation of a HiSilicon Kirin 970 CPU, the segment of usage (computer, server or mobile type), the preceding model of a CPU, and its successor.
|Name:||HiSilicon Kirin 970|
|CPU group:||HiSilicon Kirin 970|
Not every CPU is equipped with a built-in graphic core. However, if HiSilicon Kirin 970 has internal graphics, it is another advantage. Please pay attention to the base and turbo clock speed of the graphic core.
|GPU name:||ARM Mali-G72 MP12|
|GPU frequency:||0.75 GHz|
|GPU (Turbo):||No turbo|
|Max. GPU Memory:||2 GB|
Hardware codec support
Technical information that does not affect the final performance.
|h265 / HEVC (8 bit):||Decode / Encode|
|h265 / HEVC (10 bit):||Decode / Encode|
|h264:||Decode / Encode|
|VP8:||Decode / Encode|
|VP9:||Decode / Encode|
|AVC:||Decode / Encode|
|VC-1:||Decode / Encode|
|JPEG:||Decode / Encode|
Which memory does HiSilicon Kirin 970 support? How many channels are operated and how large the memory capacity can be to build in the motherboard? Here are the general data on the capacity and other technology.
|Max. Memory:||8 GB|
Thermal Management (TDP)
TDP shows which cooling system is necessary for a HiSilicon Kirin 970 CPU. It stands for Thermal Design Power. Here are all the CPU specifications: the maximum temperature, the approximate thermal calculation for power supply and others.
|TDP (PL1):||9 W|
HiSilicon Kirin 970 technical specifications contain the general data on the technological process of chip production (in nanometer), the cache of L2/L3, the architecture of the central core and ISA extension.
|Instruction set (ISA):||x86-64 (64 bit)|
|Used in:||Huawei Honor 10 Huawei Note 10 Huawei Play Huawei Honor View 10 Huawei Mate 10 Pro Huawei P20 Huawei Nova 3 Huawei Nova 4|