HiSilicon Kirin 960 Testing in 0 Benchmarks. HiSilicon Kirin 960 Specifications: The architecture is Cortex-A73 / Cortex-A53 , the number of cores is 8, and the number of threads is 8. The base clock speed of HiSilicon Kirin 960 is 0.90 GHz. The model supports motherboards with a socket of N/A. The Supported Memory Type is LPDDR4-1600 (maximum 6 GB). PCIe version is .
HiSilicon Kirin 960 in 0 Benchmarks. 16 nm, 0.90 GHz
Basic specifications HiSilicon Kirin 960
HiSilicon Kirin 960 technical specifications and performance testing in benchmarks will open you to all the advantages and disadvantages of HiSilicon Kirin 960. Please learn the key figures of the clock speed and L2/L3 cache and make the right decision.
Essentials Specifications HiSilicon Kirin 960
The general technical information depicts the base data of a CPU’s number of cores and threads, and base and turbo-boost clock speed. Here are key features influencing the performance.
|CPU Cores / Threads:||8 / 8|
|Core architecture:||hybrid (big.LITTLE)|
|A core:||4x Cortex-A73|
|B core:||4x Cortex-A53|
|A-Core Frequency:||2.40 GHz|
|B-Core Frequency:||1.80 GHz|
CPU generation and family HiSilicon Kirin 960
The generation of a HiSilicon Kirin 960 CPU, the segment of usage (computer, server or mobile type), the preceding model of a CPU, and its successor.
|Name:||HiSilicon Kirin 960|
|CPU group:||HiSilicon Kirin 960|
Processor Graphics HiSilicon Kirin 960
Not every CPU is equipped with a built-in graphic core. However, if HiSilicon Kirin 960 has internal graphics, it is another advantage. Please pay attention to the base and turbo clock speed of the graphic core.
|GPU name:||ARM Mali-G71 MP8|
|GPU frequency:||0.90 GHz|
|GPU (Turbo):||No turbo|
|Max. GPU Memory:||2 GB|
Hardware codec support HiSilicon Kirin 960
Technical information that does not affect the final performance.
|h265 / HEVC (8 bit):||Decode / Encode|
|h265 / HEVC (10 bit):||Decode|
|h264:||Decode / Encode|
|VP8:||Decode / Encode|
|AVC:||Decode / Encode|
|JPEG:||Decode / Encode|
Memory Specifications HiSilicon Kirin 960
Which memory does HiSilicon Kirin 960 support? How many channels are operated and how large the memory capacity can be to build in the motherboard? Here are the general data on the capacity and other technology.
|Max. Memory:||6 GB|
Thermal Management (TDP) HiSilicon Kirin 960
TDP shows which cooling system is necessary for a HiSilicon Kirin 960 CPU. It stands for Thermal Design Power. Here are all the CPU specifications: the maximum temperature, the approximate thermal calculation for power supply and others.
|TDP (PL1):||5 W|
Additional specifications HiSilicon Kirin 960
HiSilicon Kirin 960 technical specifications contain the general data on the technological process of chip production (in nanometer), the cache of L2/L3, the architecture of the central core and ISA extension.
|Instruction set (ISA):||ARMv8-A64 (64 bit)|
|Architecture:||Cortex-A73 / Cortex-A53|