HiSilicon Kirin 950 in 0 Benchmarks. 16 nm, 1.80 GHz

HiSilicon Kirin 950 Testing in 0 Benchmarks. HiSilicon Kirin 950 Specifications: The architecture is  , the number of cores is 8, and the number of threads is 8. The base clock speed of HiSilicon Kirin 950 is 1.80 GHz. The model supports motherboards with a socket of N/A. The Supported Memory Type is LPDDR4 (maximum ).  PCIe version is .

Basic specifications HiSilicon Kirin 950

HiSilicon Kirin 950 technical specifications and performance testing in benchmarks will open you to all the advantages and disadvantages of HiSilicon Kirin 950. Please learn the key figures of the clock speed and L2/L3 cache and make the right decision.

Essentials Specifications HiSilicon Kirin 950

The general technical information depicts the base data of a CPU’s number of cores and threads, and base and turbo-boost clock speed. Here are key features influencing the performance.

CPU Cores / Threads: 8 / 8
Core architecture: hybrid (big.LITTLE)
A core: 4x Cortex-A72
B core: 4x Cortex-A53
C core: --
Hyperthreading: No
Overclocking: No
Frequency: 1.80 GHz
Turbo Frequency (1 Core): 2.30 GHz
Turbo Frequency (8 Cores): 2.30 GHz

CPU generation and family HiSilicon Kirin 950

The generation of a HiSilicon Kirin 950 CPU, the segment of usage (computer, server or mobile type), the preceding model of a CPU, and its successor.

Name: HiSilicon Kirin 950
Family: HiSilicon Kirin
CPU group: HiSilicon Kirin 950
Generation: Midgard 4
Segment: Mobile
Predecessor: --
Successor: --

Processor Graphics HiSilicon Kirin 950

Not every CPU is equipped with a built-in graphic core. However, if HiSilicon Kirin 950 has internal graphics, it is another advantage. Please pay attention to the base and turbo clock speed of the graphic core.

GPU name: ARM Mali-T880 MP4
GPU frequency: 0.90 GHz
GPU (Turbo): 0.90 GHz
Execution units: 4
Shader: 64
Max. GPU Memory: --
Max. displays: 2
Generation: Midgard 4
Direct X: 11
Technology: 16 nm
Release date: Q2/2016

Hardware codec support HiSilicon Kirin 950

Technical information that does not affect the final performance.

h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode
h264: Decode / Encode
VP8: Decode / Encode
VP9: No
AV1: No
AVC: No
VC-1: No
JPEG: Decode / Encode

Memory Specifications HiSilicon Kirin 950

Which memory does HiSilicon Kirin 950 support? How many channels are operated and how large the memory capacity can be to build in the motherboard? Here are the general data on the capacity and other technology.

Memory type: LPDDR4
Memory channels: 2
ECC: No
AES-NI: No

Thermal Management (TDP) HiSilicon Kirin 950

TDP shows which cooling system is necessary for a HiSilicon Kirin 950 CPU. It stands for Thermal Design Power. Here are all the CPU specifications: the maximum temperature, the approximate thermal calculation for power supply and others.

TDP (PL2): --
TDP up: --
TDP down: --
Tjunction max.: --

Additional specifications HiSilicon Kirin 950

HiSilicon Kirin 950 technical specifications contain the general data on the technological process of chip production (in nanometer), the cache of L2/L3, the architecture of the central core and ISA extension.

Instruction set (ISA): x86-64 (64 bit)
L2-Cache: --
L3-Cache: --
Technology: 16 nm
Virtualization: None
Socket: N/A
Release date: Q4/2015
Part Number: --

Use Conditions HiSilicon Kirin 950

Used in: Unknown
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