HiSilicon Kirin 920 in 0 Benchmarks. 32nm, 0.60 GHz

HiSilicon Kirin 920 Testing in 0 Benchmarks. Specifications: The architecture is Cortex-A15 / Cortex-A7 , the number of cores is 8, and the number of threads is 8. The base clock speed of HiSilicon Kirin 920 is 0.60 GHz. The model supports motherboards with a socket of N/A. The Supported Memory Type is LPDDR3-1600 (maximum ).  PCIe version is .

Basic specifications HiSilicon Kirin 920

HiSilicon Kirin 920 technical specifications and performance testing in benchmarks will open you to all the advantages and disadvantages of HiSilicon Kirin 920. Please learn the key figures of the clock speed and L2/L3 cache and make the right decision.

Technical specs

The general technical information depicts the base data of a CPU’s number of cores and threads, and base and turbo-boost clock speed. Here are key features influencing the performance.

CPU Cores / Threads: 8 / 8
Core architecture: hybrid (big.LITTLE)
A core: 4x Cortex-A15
B core: 4x Cortex-A7
Hyperthreading: No
Overclocking: No
A-Core Frequency: 1.70 GHz
B-Core Frequency: 1.30 GHz

CPU generation and family

The generation of a HiSilicon Kirin 920 CPU, the segment of usage (computer, server or mobile type), the preceding model of a CPU, and its successor.

Name: HiSilicon Kirin 920
Family: HiSilicon Kirin
CPU group: HiSilicon Kirin 920
Generation: Midgard 2
Segment: Mobile
Predecessor: --
Successor: --

iGPU

Not every CPU is equipped with a built-in graphic core. However, if HiSilicon Kirin 920 has internal graphics, it is another advantage. Please pay attention to the base and turbo clock speed of the graphic core.

GPU name: ARM Mali-T628 MP4
GPU frequency: 0.60 GHz
GPU (Turbo): 0.60 GHz
Execution units: 4
Shader: 64
Max. GPU Memory: --
Max. displays: 1
Generation: Midgard 2
Direct X: 11
Technology: 32nm
Release date: Q4/2012

Hardware codec support

Technical information that does not affect the final performance.

h265 / HEVC (8 bit): No
h265 / HEVC (10 bit): No
h264: Decode / Encode
VP8: Decode / Encode
VP9: No
AV1: No
AVC: No
VC-1: No
JPEG: No

Memory Specifications

Which memory does HiSilicon Kirin 920 support? How many channels are operated and how large the memory capacity can be to build in the motherboard? Here are the general data on the capacity and other technology.

Memory type: LPDDR3-1600
Memory channels: 2
Bandwidth: --
ECC: No
AES-NI: No

Thermal Management (TDP)

TDP shows which cooling system is necessary for a HiSilicon Kirin 920 CPU. It stands for Thermal Design Power. Here are all the CPU specifications: the maximum temperature, the approximate thermal calculation for power supply and others.

TDP (PL2): --
TDP up: --
TDP down: --
Tjunction max.: --

Additional specifications

HiSilicon Kirin 920 technical specifications contain the general data on the technological process of chip production (in nanometer), the cache of L2/L3, the architecture of the central core and ISA extension.

Instruction set (ISA): ARMv7-A32 (32 bit)
L2-Cache: --
L3-Cache: --
Architecture: Cortex-A15 / Cortex-A7
Virtualization: None
Socket: N/A
Part Number: --