HiSilicon Kirin 910 in 0 Benchmarks. 28nm, 1.60 GHz

HiSilicon Kirin 910 Testing in 0 Benchmarks. Specifications: The architecture is  , the number of cores is 4, and the number of threads is 4. The base clock speed of HiSilicon Kirin 910 is 1.60 GHz. The model supports motherboards with a socket of N/A. The Supported Memory Type is LPDDR3 (maximum ).  PCIe version is .

Basic specifications HiSilicon Kirin 910

HiSilicon Kirin 910 technical specifications and performance testing in benchmarks will open you to all the advantages and disadvantages of HiSilicon Kirin 910. Please learn the key figures of the clock speed and L2/L3 cache and make the right decision.

Technical specs

The general technical information depicts the base data of a CPU’s number of cores and threads, and base and turbo-boost clock speed. Here are key features influencing the performance.

CPU Cores / Threads: 4 / 4
Core architecture: normal
A core: --
B core: --
C core: --
Hyperthreading: No
Overclocking: No
Frequency: 1.60 GHz
Turbo Frequency (1 Core): 1.60 GHz
Turbo Frequency (4 Cores): 1.60 GHz  

CPU generation and family

The generation of a HiSilicon Kirin 910 CPU, the segment of usage (computer, server or mobile type), the preceding model of a CPU, and its successor.

Name: HiSilicon Kirin 910
Family: HiSilicon Kirin
CPU group: HiSilicon Kirin 910/920
Generation: Utgard
Segment: Mobile
Predecessor: --
Successor: --


Not every CPU is equipped with a built-in graphic core. However, if HiSilicon Kirin 910 has internal graphics, it is another advantage. Please pay attention to the base and turbo clock speed of the graphic core.

GPU name: ARM Mali-450 MP4
GPU frequency: 0.53 GHz
GPU (Turbo): 0.53 GHz
Execution units: 4
Shader: 64
Max. GPU Memory: --
Max. displays: 1
Generation: Utgard
Technology: 28nm
Release date: 2012

Hardware codec support

Technical information that does not affect the final performance.

h265 / HEVC (8 bit): No
h265 / HEVC (10 bit): No
h264: No
VP8: No
VP9: No
AV1: No
VC-1: No

Memory Specifications

Which memory does HiSilicon Kirin 910 support? How many channels are operated and how large the memory capacity can be to build in the motherboard? Here are the general data on the capacity and other technology.

Memory type: LPDDR3
Memory channels: 1

Thermal Management (TDP)

TDP shows which cooling system is necessary for a HiSilicon Kirin 910 CPU. It stands for Thermal Design Power. Here are all the CPU specifications: the maximum temperature, the approximate thermal calculation for power supply and others.

TDP (PL2): --
TDP up: --
TDP down: --
Tjunction max.: --

Additional specifications

HiSilicon Kirin 910 technical specifications contain the general data on the technological process of chip production (in nanometer), the cache of L2/L3, the architecture of the central core and ISA extension.

Instruction set (ISA): x86-64 (64 bit)
L2-Cache: --
L3-Cache: --
Technology: 28 nm
Virtualization: None
Socket: N/A
Release date: Q1/2014
Part Number: --

Use Conditions

Used in: Unknown