HiSilicon Kirin 710 in 0 Benchmarks. 12 nm, 0.65 GHz

HiSilicon Kirin 710 Testing in 0 Benchmarks. HiSilicon Kirin 710 Specifications: The architecture is Cortex-A73 / Cortex-A53 , the number of cores is 8, and the number of threads is 8. The base clock speed of HiSilicon Kirin 710 is 0.65 GHz. The model supports motherboards with a socket of N/A. The Supported Memory Type is LPDDR3 LPDDR4 (maximum 6 GB).  PCIe version is .

Basic specifications HiSilicon Kirin 710

HiSilicon Kirin 710 technical specifications and performance testing in benchmarks will open you to all the advantages and disadvantages of HiSilicon Kirin 710. Please learn the key figures of the clock speed and L2/L3 cache and make the right decision.

Essentials Specifications HiSilicon Kirin 710

The general technical information depicts the base data of a CPU’s number of cores and threads, and base and turbo-boost clock speed. Here are key features influencing the performance.

CPU Cores / Threads: 8 / 8
Core architecture: hybrid (big.LITTLE)
A core: 4x Cortex-A73
B core: 4x Cortex-A53
Hyperthreading: No
Overclocking: No
A-Core Frequency: 2.20 GHz
B-Core Frequency: 1.70 GHz

CPU generation and family HiSilicon Kirin 710

The generation of a HiSilicon Kirin 710 CPU, the segment of usage (computer, server or mobile type), the preceding model of a CPU, and its successor.

Name: HiSilicon Kirin 710
Family: HiSilicon Kirin
CPU group: HiSilicon Kirin 710
Generation: Bifrost 1
Segment: Mobile
Predecessor: --
Successor: --

Processor Graphics HiSilicon Kirin 710

Not every CPU is equipped with a built-in graphic core. However, if HiSilicon Kirin 710 has internal graphics, it is another advantage. Please pay attention to the base and turbo clock speed of the graphic core.

GPU name: ARM Mali-G51 MP4
GPU frequency: 0.65 GHz
GPU (Turbo): 1.00 GHz
Execution units: 8
Shader: 128
Max. GPU Memory: 4 GB
Max. displays: 2
Generation: Bifrost 1
Direct X: 11
Technology: 12 nm
Release date: Q2/2018

Hardware codec support HiSilicon Kirin 710

Technical information that does not affect the final performance.

h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): No
h264: Decode / Encode
VP8: Decode / Encode
VP9: Decode / Encode
AV1: No
AVC: Decode / Encode
VC-1: Decode / Encode
JPEG: Decode / Encode

Memory Specifications HiSilicon Kirin 710

Which memory does HiSilicon Kirin 710 support? How many channels are operated and how large the memory capacity can be to build in the motherboard? Here are the general data on the capacity and other technology.

Memory type: LPDDR3 LPDDR4
Max. Memory: 6 GB
Memory channels: 2
Bandwidth: --
ECC: No
AES-NI: No

Thermal Management (TDP) HiSilicon Kirin 710

TDP shows which cooling system is necessary for a HiSilicon Kirin 710 CPU. It stands for Thermal Design Power. Here are all the CPU specifications: the maximum temperature, the approximate thermal calculation for power supply and others.

TDP (PL1): 5 W
TDP (PL2): --
TDP up: --
TDP down: --
Tjunction max.: --

Additional specifications HiSilicon Kirin 710

HiSilicon Kirin 710 technical specifications contain the general data on the technological process of chip production (in nanometer), the cache of L2/L3, the architecture of the central core and ISA extension.

Instruction set (ISA): ARMv8-A64 (64 bit)
L2-Cache: --
L3-Cache: 1.00 MB
Architecture: Cortex-A73 / Cortex-A53
Virtualization: None
Socket: N/A
Part Number: --
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